I have a few very headaches. After studying for a few days, I feel that some of them can’t figure out the logic, so I can only ask the expert readers for advice.

1. Single crystal silicon rod production capacity problem: The approximately processing time of a 12-inch single crystal rod with a length of 1.5 meters is 100 hours, but in fact, the JD1600 single crystal furnace has a maximum melt volume of 1,000 kilograms, and this loss is roughly

What is it? If there is no loss, it can actually pull 6 meters long single crystal silicon.

It takes about 400 hours. Except for work shutdowns, cleaning and other work, it takes about 600 hours, which is about 25 days.

The thickness of an inch wafer is about 0.775 mm at the beginning, but later it is processed and thinned to 190 microns or even 150 um.

What is the approximate diameter of this gold steel wire?

0.1 mm? It's so thin that it's not easy to break?

That is to say, the initial thickness required for a wafer is = 0.775 (initial thickness of wafer) + 0.1 (diamond line diameter) = 0.885 mm

With a 6-meter-long single-crystal silicon rod, you can calculate how many wafers you can cut out.

If it is not considered cutting pieces, about 6,000 pieces?

This data feels a bit exaggerated.

So, how much does a 6-meter-long single crystal silicon cost?

How much does it cost to sell to a chip manufacturer?

Can a single crystal furnace with 10MW power meet the requirements?

It is often heard that building a 1GW single crystal silicon wafer production capacity generally requires 100 single crystal furnaces with 10MW power.

Generally, single crystal silicon factories have 20GW, which is 2,000 single crystal furnaces?

Produce 2,000 single crystal silicon rods per month?

12 million wafers?

This data logic is not normal.

The main reason is that this logical problem cannot be understood.

Generally, wafer factories have a monthly production capacity of about tens of thousands of wafers, because processing wafers is too time-consuming, such as grinding too takes too much time and is easy to break.

Of course, wafer processing and production of single crystal silicon rods are two different things.

Please ask: Is the same factory for single crystal silicon rod production and circular crystal processing?

2. The shipment rate of wafers.

The surface area of ​​the 12-inch wafer is about 70,659 square millimeters. It is said that the shipment rate is about 65%. Take Huawei Kirin 990 5G as an example. Its chip area is 113.31 square millimeters (this is the only place to integrate up to 10.3 billion.

Transistors), which are the yield rate, can ship about 300 chips.

A monthly output of 50,000 pieces is 15 million chips, which can satisfy the use of 15 million mobile phones?

Recently, my mind is very swelling when learning monocrystalline silicon, round crystals and chip processing, and it is too troublesome to settle the accounts.

Maybe most readers can’t find any mistakes when writing it casually, but I still don’t want to be too casual. Some things must be rigorous. I hope you can give me some advice if you understand them.
Chapter completed!